Technology Innovation
    Controlled-Morphology Metal-Oxides 
    • Manufacturing: ORNL coating technology is superior to current commercial practices 
      in terms of scalability, low-cost capital investment,  (e.g., PVD, CVD, sol-gel)
    • Controlled Nanoparticle Shape: ORNL process has distinct economic and 
      manufacturing advantages over existing technologies to control shape and 
      morphology (e.g., Photolithography, Microfludic Synthesis, and Molding)
               Metal oxide nanotechnology is applied to almost all areas of the society
               Displays                    Lighting                  Solar energy            Bio-imaging
         Environmentally friendly way of making low cost technologically important materials
  2
 Low cost controlled morphology metal oxides for multifunctional coatings
          Green Nanotechnology              Controllable Morphology
                                                Decrease in ITO precursor
                           Green
                           Scalable
       ITO        CNF in   Low cost
      precursor    water
       ITO: indium tin oxide; CNF: cellulose nanofibrils
                                                CNF         Metal ion
    Comparable properties to PVD coating          Versatility
                                               Zinc oxide nanoparticles
         80% transparency
                           Low resistance
                           150 Ω/□
     Novel Process
         ORNL’S Technology: A Cleaner, Cheaper Way to Make Metal-oxides particles and films
                                                                                                          Controlled 
                           Remove                               Heat                                     Morphology
                                
                            water
      Metal ion conjugation       CNF Film with controllable 
         to CNF in water                density and 3D                                                      Sintered
             (2 mins)              distribution of metal ions                                               Particles
             -  Cellulose Nanofibrils (CNF)
              -  Metal cation                              Clean Technology
                                                           Cost Effective
                                                           Transformational
   4
      Current Practice
                                                                                                              Vacuum Required
                                                      Physical Vapor                                                                               D
                                                                                                              Limited Target Size                  e
                                                          Deposition                                                                               c
                                                                                                                                                   r
                                                                                                                                                   e
                                                                                                             High Cost and Poor                    a
                                                                                                                   Stability                       s
                                                                                                                                                   e
                                                                                                                                                    
                                                                                                                                                   i
                                                                                                                                                   n
                                                                                                                                                    
                                                                                                             Improved Scalability                  c
                                                                                                                                                   o
               Metal Oxide                                                                                                                         s
                                                                                                                                                   t
                                                                                                                                                    
                                                      Chemical Vapor                                        Hazardous byproducts                   /
                                                                                                                                                   I
                       Film                               Deposition                                               (CO, H2)                        n
                                                                                                                                                   c
                Fabrication                                                                                                                        r
                                                                                                                                                   e
                                                                                                                  High Cost                        a
                                                                                                                                                   s
                                                                                                                                                   e
                                                                                                                                                    
                                                                                                                                                   i
                                                                                                                                                   n
                                                                                                            Nanoparticle Sintering                  
                                                                                                                                                   s
                                                                                                                                                   c
                                                                                                                                                   a
                                                                                                                                                   l
                                                          Solid State                                        Excellent Scalability                 a
                                                           Sintering                                                                               b
                                                                                                                                                   i
                                                                                                                                                   l
                                                                                                                                                   i
                                                                                                                                                   t
                                                                                                                  Low Cost                         y
   5
   Intellectual Property
       • Patent Application No. 14/551,460 filed on Nov 24, 
         2014; US Patent No.:  9,340,461 granted 05/17/2016.
       • Patent Cooperation Treaty - PCT/US15/61459 
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